Audi's Ricky Hudi (l) and NXP's Kurt Sievers signed the agreement at the electronica 2012 fair in Munich (Photo: NXP)
Audi has signed a strategic partnership with semiconductor maker NXP to boost innovation speed and time to market of new automotive electronics applications.
The areas covered range from in-vehicle networking and car entertainment to emerging technologies for the connected car.
Audi's chief executive engineer for electrics and electronics, Ricky Hudi, said in a press release that the partnership is a "milestone" in the premium car maker's Progressive Semiconductor Program (PSCP), a strategy aimed atÂ intensifying the role and engagement of semiconductor companies in its development processes.
Last month, Audi signed a comparable agreement to boost innovation with NXP competitor STMicroelectronics. The two companies said they would jointly develop semiconductor solutions to reduce CO2 emissions, boost automotive safety and improve infotainment and comfort.
The agreement with NXP signed Tuesday "reinforcesÂ that NXP’s focus on technologies for the connected car is spot on with where the industry is going," said Kurt Sievers, who heads NXP's global automotive business.